。
•Dedicated Bi-Wire Jumper replaces stock items
•Dual Mono-Filament technology
•TSC (Total Signal Control) technology
•Mechanically tuned for optimum results
•OFC solid-core conductors
•Plated with 85 microns of silver
•High Performance FEP Internal Insulation reduces dielectric properties and increases signal speed
•Lightweight gold plated connectors in multiple configurations ensure peak musical performance
• Bi-Wire 跳線專用
• Dual Mono-Filament technology(雙單絲技術)
• TSC (Total Signal Control) technology(完整訊號控制)
• Mechanically tuned for optimum results (機械調整)
• OFC solid-core conductors(無氧銅實心導體)
• Plated with 85 microns of silver(表層鍍 85 microns 銀)
• High Performance FEP Internal Insulation reduces dielectric properties and increases signal speed (高性能FEP擠壓技術、降低電介質特性,增加訊號傳輸速度)
• Lightweight gold plated connectors in multiple configurations ensure peak musical performance(輕量鍍金端子,增加動態音樂性能)